■ FOWLP: Fan-Out Wafer Level Package
■ FIWLP: Fan-In Wafer Level Package
■ EWLP: Embedded Wafer Level Package
■ WCM-330
■ WCM-330MS
■ LMP-600AUTO SYSTEM
■ LMP-600 MS
■ CDIM-500
■ Independent control of 4-axis servo motors enables platen tilt adjustment by changing motor parameters
■ Pursuit of WLP molding quality by 8-stage resin flow control
■ Stable high-speed transfer even for warped wafers
■ Measures against electrostatic discharge (ESD) are taken at the wafer contact area
| Model | Wafer size(inch) | Press type(t) |
| WCM-330 | 8/12 | 85 |
| WCM-330MS | 8/12 | 36/85 |
