For wafer bump molding
FR-N01S
Excellent wettability, tackiness, and cleanability
■ Stickiness：17 x 10.3 Pa?S
■ Solids content：30%
■ Halogen content：0.0%
■ Stain remover：Para-aqueous detergent Warm water
■ Coating methods：Spraying, spin coating
