Manual batch exposure machine for experiments and research on glass, wafer, film, etc

■ MA-1200

■ MA-1400

■ MA-1200A

■ MA-4301M

■ You can choose between contact exposure (hard and soft) and close exposure 

• Supports a maximum of 500mm x 500mm substrate. According to the application and substrate size, it is equipped with ultra-high pressure mercury lamp (500W, 1kW, 2kW, 3.5kW) and optical system, which perfectly combines various mirrors, special lenses, condenser lenses and so on

■ Manual batch exposure machine, suitable for multi-variety, small batch production, experiment and research, can achieve stable automatic gap control

■ Save space by taking up less space

■ Original high-speed image processing technology allows highly accurate mask alignment with wafer                        

■ Auto-mask changer is mounted. Applicable to mask library

■ Non-contact pre-aligner is mounted. High precision feeding is achieved without damaging substrates

■ DNK original parallel compensating mechanism accurately controls proximity gap

■ Original mirror optical system is mounted. Uniform illumination over irradiated plane and high intensity are achieved

■ Wafer MateriaI: Si﹐GIass

■ Wafer Dimension: 8"(φ200 mm)      12"(φ300 mm) 

■ Exposure method: Soft contact exposure /  Hard contact exposure / Proximity exposure                                                          

■ Main body dimensions: W 2600 x D 2300 x H 2350 mm 

■ Main body : 2300 kg                                                           

■ Lamp house : 700 kg